In-situ study of electrochemical migration of tin in the presence of bromide ion

Abstract The miniaturization of electronic devices and the consequent decrease in distance between conductive lines have increased risk short circuit failure due to electrochemical migration (ECM). presence ionic contaminants affects ECM process. This work systematically investigates tin (Sn) bromide ions (Br ? ) range 10 ?6 M 1.0 M. Water drop test (WDT) was conducted two-probe semiconductor characterization system under an optical microscope as in-situ observation. Polarization carried out study correlation corrosion properties Sn its behaviour. products were characterized by scanning electron coupled with energy dispersive X-rays spectrometer (SEM/EDX) X-ray photoelectron (XPS). results confirm that rate anodic dissolution monotonously increases Br concentration. However, probability follows a normal distribution initially, but later main reactions are identified dendrites hydroxide precipitates. mechanisms process also suggested.